電子基板及び電気光学装置並びに電子機器

Electronic substrate, electrooptical device, and electronic equipment

Abstract

【課題】高精度の抵抗部を容易に形成する。 【解決手段】基板P上に電極パッド及び配線パターン20、21が設けられる。配線パターンは、電極パッドの表面から樹脂突起の表面を越えて、電極パッドと逆側の方向に延び、且つ逆側において一部の配線諸元を、他の部分と異ならせて抵抗素子Rを形成する。 【選択図】図4
<P>PROBLEM TO BE SOLVED: To avoid a decrease in productivity by easily forming a precise resistance section. <P>SOLUTION: An electrode pad and wiring patterns 20, 21 are provided on a substrate P of an electronic substrate. The wiring pattern is extended in a direction at a side opposite to the electrode pad over the surface of a resin projection from the surface of the electrode pad, and forms a resistive element R by allowing partial wiring features to differ from those of other parts at an opposite side. <P>COPYRIGHT: (C)2009,JPO&INPIT

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Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    JP-2003031724-AJanuary 31, 2003Hitachi Ltd, 株式会社日立製作所Semiconductor module
    JP-2003124393-AApril 25, 2003Hitachi Ltd, 株式会社日立製作所Semiconductor device and manufacturing method therefor
    JP-2004296761-AOctober 21, 2004Mitsumi Electric Co Ltd, ミツミ電機株式会社半導体装置
    JP-H05145018-AJune 11, 1993Yamaha Corp, ヤマハ株式会社Resistor forming method
    JP-S63152164-AJune 24, 1988Fuji Electric Co LtdSemiconductor device
    WO-03007379-A1January 23, 2003Hitachi, Ltd.Composant de circuit electronique

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