Polishing device and polishing pad regeneration treatment method

研磨装置、および研磨パッド再生処理方法

Abstract

【課題】CMP装置のスループットの改善とダウンタイムの低減を図る。 【解決手段】回転する研磨パッド5にウェハを研磨ヘッド1で押し付けて研磨加工する前後にて研磨パッド5の再生処理の為、底面にダイヤモンド砥粒が底面に固定された第1ドレッサ8および第2ドレッサ9を研磨パッド5上でそれぞれ自転させ、かつ同時に揺動させる構成である。 【選択図】図1
<P>PROBLEM TO BE SOLVED: To improve through-put of a CMP device and to reduce a down-time. <P>SOLUTION: This polishing device is constituted to make a first dresser 8 and a second dresser 9 on the bottom surfaces of which diamond abrasive grains are fixed respectively, autorotate on a polishing pad 5 so as to reproduce and treat the polishing pad 5 before and after polishing and working a wafer by pushing it on the rotating polishing pad 5 by a polishing head 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

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